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Case number IPR2019-00023

Samsung Electronics Co., Ltd. v. Invensas Bonding Technologies, Inc. > Summary

Court Case Number IPR2019-00023

Filing Date Oct 2, 2018

Institution Decision Date -

Decision Date Dec 21, 2018

Court Patent Trial and Appeal Board

Status Terminated-Settled

Administrative JudgesKen B. Barrett, Frances L. Ippolito, Christopher C. Kennedy

Judge Writing the Final DecisionKen B. Barrett

Claims Challenged in the Petition: 77, 79, 80, 81, 82, 84, 93, 94, 95, 99, 100, 101, 104, 105, 106, 110, 111, 112, 113, 114, 192, 197

Related Patents

Doc No Title Issue date
08153505 Method for low temperature bonding and bonded structure Apr 10, 2012
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