Case number IPR2018-01401
Samsung Electronics Co., Ltd. v. Invensas Corporation > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Feb 6, 2019 | 13 | Notice of Refund Download | |
| Jan 9, 2019 | 12 | Petitioner's Request for Refund of Fees Download | |
| Jan 4, 2019 | 11 | Termination Decision Document Download | |
| Dec 13, 2018 | 10 | Joint Request to File Settlement Agreement and Consent Letter As Business Confidential Information Under 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Dec 13, 2018 | 9 | Joint Motion to Terminate Proceeding Pursuant to 35 U.S.C. 317 and 37 C.F.R. 42.74 Download | |
| Nov 29, 2018 | 8 | Patent Owner's Preliminary Response Download | |
| Aug 29, 2018 | 7 | Notice of Accord Filing Date Download | |
| Aug 1, 2018 | 5 | Patent Owner's Power of Attorney Download | |
| Aug 1, 2018 | 6 | Patent Owner's Mandatory Notices Download | |
| Jul 13, 2018 | 1008 | U.S. Patent No. 6,365,521 ("Shubert") Download | |
| Jul 13, 2018 | 1010 | U.S. Patent No. 6,120,361 ("Konishi") Download | |
| Jul 13, 2018 | 1004 | Prosecution File History of U.S. Patent No. 6,232,231 Download | |
| Jul 13, 2018 | 1005 | U.S. Patent No. 5,948,573 ("Takahashi") Download | |
| Jul 13, 2018 | 1019 | U.S. Patent No. 6,103,626 to Kim Download | |
| Jul 13, 2018 | 1017 | U.S. Patent No. 6,309,956 to Chiang et al. Download | |
| Jul 13, 2018 | 1020 | U.S. Patent No. 6,261,883 to Koubuchi et al. Download | |
| Jul 13, 2018 | 3 | Petitioner Samsung Electronics America, Inc.'s Power of Attorney Download | |
| Jul 13, 2018 | 1015 | U.S. Patent No. 6,109,775 to Tripathi et al. Download | |
| Jul 13, 2018 | 1018 | U.S. Patent No. 5,854,125 to Harvey Download | |
| Jul 13, 2018 | 1014 | L. Zuckerman, "IBM to Make Smaller and Faster Chips - Second Breakthrough in a Week Has Wide Uses," The New York Times, D1, Monday, September 22, 1997 Download | |
| Jul 13, 2018 | 4 | Petitioner Samsung Austin Semiconductor LLC's Power of Attorney Download | |
| Jul 13, 2018 | 1 | Petition for Inter Partes Review of U.S. Patent No. 6,232,231 Download | |
| Jul 13, 2018 | 1009 | U.S. Patent No. 5,972,792 ("Hudson") Download | |
| Jul 13, 2018 | 1006 | Japanese Patent Application 4-262535 Download | |
| Jul 13, 2018 | 1013 | Semiconductor Industry Association, The National Technological Roadmap for Semiconductors: Technology Needs, 1997 Edition Download | |
| Jul 13, 2018 | 2 | Petitioner Samsung Electronics Co., Ltd.'s Power of Attorney Download | |
| Jul 13, 2018 | 1016 | T. H. Park, Framework for Characterization of Copper Interconnect in Damascene CMP Processes, 1998 Download | |
| Jul 13, 2018 | 1012 | U.S. Patent No. 5,302,551 to Iranmanesh et al. Download | |
| Jul 13, 2018 | 1001 | U.S. Patent No. 6,232,231 ("the '231 Patent") Download | |
| Jul 13, 2018 | 1002 | Declaration of Dr. Michael Thomas Download | |
| Jul 13, 2018 | 1003 | Curriculum Vitae for Dr. Michael Thomas Download | |
| Jul 13, 2018 | 1021 | U.S. Patent No. 5,874,318 to Baker Download | |
| Jul 13, 2018 | 1007 | Certified English Translation of Japanese Patent Application 4-262535 ("Tonishi") Download | |
| Jul 13, 2018 | 1011 | Declaration of Martin Cross Regarding Translation of References from Japanese to English Download |
