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Case number IPR2020-01729

Semiconductor Components Industries, LLC d/b/a ON Semiconductor et al. v. Invensas Corporation et al. > Documents

Date Field Doc. No.PartyDescription
Sep 1, 2021 10 board Final Written Decision: original Download
Dec 28, 2020 9 board Download
Dec 17, 2020 8 board Decision - Granting Institution of Inter Partes Review; Granting Motion for Joinder Download
Dec 4, 2020 7 patent_own Patent Owner Non-Opposition to Joinder Motion Download
Oct 21, 2020 6 patent_own Patent Owner Power of Attorney Download
Oct 21, 2020 5 patent_own Patent Owner Mandatory Notices Download
Oct 8, 2020 4 board Notice of Accord Filing Date Download
Sep 30, 2020 1007 petitioner CMP Applications for Sub-0.25m Process Technologies by D. Pramanik et al., Proceedings of the Second International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1998) Download
Sep 30, 2020 1008 petitioner U.S. Patent No. 5,879,222 Download
Sep 30, 2020 1009 petitioner Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 3 Download
Sep 30, 2020 1009 petitioner Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 1 Download
Sep 30, 2020 1009 petitioner Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 4 Download
Sep 30, 2020 1009 petitioner Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 2 Download
Sep 30, 2020 1010 petitioner Digital Integrated Circuits by J. Rabaey (Rabaey) PART 3 Download
Sep 30, 2020 1010 petitioner Digital Integrated Circuits by J. Rabaey (Rabaey) PART 4 Download
Sep 30, 2020 1010 petitioner Digital Integrated Circuits by J. Rabaey (Rabaey) PART 2 Download
Sep 30, 2020 1010 petitioner Digital Integrated Circuits by J. Rabaey (Rabaey) PART 1 Download
Sep 30, 2020 1011 petitioner Chemical Mechanical Planarization of Microelectronic Materials by J. Steigerwald et al. (Steigerwald) Download
Sep 30, 2020 1012 petitioner Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 2 Download
Sep 30, 2020 1012 petitioner Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 1 Download
Sep 30, 2020 1012 petitioner "Principles of CMOS VLSI Design 2nd Edition" by N. Weste and K. Eshraghian ("Weste") PART 3 Download
Sep 30, 2020 1013 petitioner Implementation of CMP-based design rules and pattern practices by L. E. Camilletti, Proc. IEEE/SEMI Adv. Semiconduct. Manufact. Conf., October 1995, pp. 2-4 (Camilletti) Download
Sep 30, 2020 1014 petitioner The role of dummy fill patterning practices on intra-die ILD thickness variation in CMP processes by B. Stine et al., Proc. VLSI Multilevel Interconnect Conf., June 1996, pp. 421-423 (Stine) Download
Sep 30, 2020 1015 petitioner Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing, by H. Landis et al., Thin Solid Films (1992) 1-7 (Landis) Download
Sep 30, 2020 1016 petitioner Multilevel interconnect system for 0.35-m CMOS LSIs with metal dummy planarization process and thin tungsten wirings, by Ichikawa et al., VLSI Multilevel Interconnect Conf., June 1995, pp. 254-260 (Ichikawa) Download
Sep 30, 2020 1017 petitioner U.S. Patent No. 5,948,573 Download
Sep 30, 2020 1 petitioner PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,232,231 Download
Sep 30, 2020 1019 petitioner U.S. Patent No. 5,928,959 Download
Sep 30, 2020 1020 petitioner U.S. Patent No. 5,721,172 Download
Sep 30, 2020 1021 petitioner U.S. Patent No. 5,943,590 Download
Sep 30, 2020 1022 petitioner U.S. Patent No. 5,602,423 Download
Sep 30, 2020 1023 petitioner U.S. Patent No. 5,652,465 Download
Sep 30, 2020 1024 petitioner U.S. Patent No. 6,103,626 Download
Sep 30, 2020 1025 petitioner U.S. Patent No. 5,923,563 Download
Sep 30, 2020 1026 petitioner U.S. Patent No. 6,109,775 Download
Sep 30, 2020 1027 petitioner Email from Duane Boning dated March 10, 1998 Download
Sep 30, 2020 1028 petitioner Claim Construction Order (Nov. 16, 2018) from Case 1:17-cv-01363-MN (D. Del.) Download
Sep 30, 2020 1029 petitioner Claim Construction Order (Oct. 26, 2018) from Case 2:17-CV-00670-RWS-RSP (E.D. Tx.) Download
Sep 30, 2020 1030 petitioner IPR2017-00831 Decision Denying Institution of Inter Partes Review (Paper 8) Download
Sep 30, 2020 1031 petitioner IPR2018-01401 Petition for Inter Partes Review of U.S. Patent No. 6,232,231 Download
Sep 30, 2020 1032 petitioner IPR2018-01401 Decision to Terminate Proceeding (Paper 11) Download
Sep 30, 2020 1033 petitioner Feb. 24, 2003 Amendment from Prosecution of U.S. Patent No. 6,849,946 Download
Sep 30, 2020 1034 petitioner Printout of Electrochemical Society webpage on 2/19/2020 of https://www.electrochem.org/dl/pv/published/1996/1996.htm Download
Sep 30, 2020 2 petitioner Power of Attorney Download
Sep 30, 2020 3 petitioner Motion for Joinder to Inter Parties Review IPR2020-00603 Download
Sep 30, 2020 1006 petitioner Integration of CMP Into Deep Sub-micron Multilevel Metallization Circuits by D. Pramanik et al., Proceedings of the First International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1997) Download
Sep 30, 2020 1005 petitioner The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes, by B. Stine et al., IEEE Trans. On Elec. Devices, Vol. 45 No. 3 March 1998, pp. 665-679 (Stine1998) Download
Sep 30, 2020 1004 petitioner U.S. Patent No. 6,093,631 Download
Sep 30, 2020 1003 petitioner Prosecution History for U.S. Patent No. 6,232,231 Download
Sep 30, 2020 1002 petitioner Declaration of Dr. Duane S. Boning Download
Sep 30, 2020 1001 petitioner U.S. Patent No. 6,232,231 Download
Sep 30, 2020 1018 petitioner U.S. Patent No. 5,639,679 Download
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