Date Field | Doc. No. | Party | Description |
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Sep 30, 2020 | 1034 | petitioner | Printout of Electrochemical Society webpage on 2/19/2020 of https://www.electrochem.org/dl/pv/published/1996/1996.htm Download |
Sep 30, 2020 | 1033 | petitioner | Feb. 24, 2003 Amendment from Prosecution of U.S. Patent No. 6,849,946 Download |
Sep 30, 2020 | 1032 | petitioner | IPR2018-01401 Decision to Terminate Proceeding (Paper 11) Download |
Sep 30, 2020 | 1031 | petitioner | IPR2018-01401 Petition for Inter Partes Review of U.S. Patent No. 6,232,231 Download |
Sep 30, 2020 | 1030 | petitioner | IPR2017-00831 Decision Denying Institution of Inter Partes Review (Paper 8) Download |
Sep 30, 2020 | 1029 | petitioner | Claim Construction Order (Oct. 26, 2018) from Case 2:17-CV-00670-RWS-RSP (E.D. Tx.) Download |
Sep 30, 2020 | 1028 | petitioner | Claim Construction Order (Nov. 16, 2018) from Case 1:17-cv-01363-MN (D. Del.) Download |
Sep 30, 2020 | 1027 | petitioner | Email from Duane Boning dated March 10, 1998 Download |
Sep 30, 2020 | 1026 | petitioner | U.S. Patent No. 6,109,775 Download |
Sep 30, 2020 | 1025 | petitioner | U.S. Patent No. 5,923,563 Download |
Sep 30, 2020 | 1024 | petitioner | U.S. Patent No. 6,103,626 Download |
Sep 30, 2020 | 1023 | petitioner | U.S. Patent No. 5,652,465 Download |
Sep 30, 2020 | 1022 | petitioner | U.S. Patent No. 5,602,423 Download |
Sep 30, 2020 | 1021 | petitioner | U.S. Patent No. 5,943,590 Download |
Sep 30, 2020 | 1020 | petitioner | U.S. Patent No. 5,721,172 Download |
Sep 30, 2020 | 1019 | petitioner | U.S. Patent No. 5,928,959 Download |
Sep 30, 2020 | 1018 | petitioner | U.S. Patent No. 5,639,679 Download |
Sep 30, 2020 | 1017 | petitioner | U.S. Patent No. 5,948,573 Download |
Sep 30, 2020 | 1016 | petitioner | Multilevel interconnect system for 0.35-m CMOS LSIs with metal dummy planarization process and thin tungsten wirings, by Ichikawa et al., VLSI Multilevel Interconnect Conf., June 1995, pp. 254-260 (Ichikawa) Download |
Sep 30, 2020 | 1015 | petitioner | Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing, by H. Landis et al., Thin Solid Films (1992) 1-7 (Landis) Download |
Sep 30, 2020 | 1014 | petitioner | The role of dummy fill patterning practices on intra-die ILD thickness variation in CMP processes by B. Stine et al., Proc. VLSI Multilevel Interconnect Conf., June 1996, pp. 421-423 (Stine) Download |
Sep 30, 2020 | 1013 | petitioner | Implementation of CMP-based design rules and pattern practices by L. E. Camilletti, Proc. IEEE/SEMI Adv. Semiconduct. Manufact. Conf., October 1995, pp. 2-4 (Camilletti) Download |
Sep 30, 2020 | 1012 | petitioner | Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 2 Download |
Sep 30, 2020 | 1012 | petitioner | Principles of CMOS VLSI Design 2nd Edition by N. Weste and K. Eshraghian (Weste) PART 1 Download |
Sep 30, 2020 | 1012 | petitioner | "Principles of CMOS VLSI Design 2nd Edition" by N. Weste and K. Eshraghian ("Weste") PART 3 Download |
Sep 30, 2020 | 1011 | petitioner | Chemical Mechanical Planarization of Microelectronic Materials by J. Steigerwald et al. (Steigerwald) Download |
Sep 30, 2020 | 1010 | petitioner | Digital Integrated Circuits by J. Rabaey (Rabaey) PART 1 Download |
Sep 30, 2020 | 1010 | petitioner | Digital Integrated Circuits by J. Rabaey (Rabaey) PART 2 Download |
Sep 30, 2020 | 1010 | petitioner | Digital Integrated Circuits by J. Rabaey (Rabaey) PART 4 Download |
Sep 30, 2020 | 1010 | petitioner | Digital Integrated Circuits by J. Rabaey (Rabaey) PART 3 Download |
Sep 30, 2020 | 1009 | petitioner | Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 2 Download |
Sep 30, 2020 | 1009 | petitioner | Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 4 Download |
Sep 30, 2020 | 1009 | petitioner | Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 1 Download |
Sep 30, 2020 | 1009 | petitioner | Introduction to VLSI Systems by C. Mead and L. Conway (Mead) PART 3 Download |
Sep 30, 2020 | 1008 | petitioner | U.S. Patent No. 5,879,222 Download |
Sep 30, 2020 | 1007 | petitioner | CMP Applications for Sub-0.25m Process Technologies by D. Pramanik et al., Proceedings of the Second International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1998) Download |
Sep 30, 2020 | 1006 | petitioner | Integration of CMP Into Deep Sub-micron Multilevel Metallization Circuits by D. Pramanik et al., Proceedings of the First International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (Pramanik1997) Download |
Sep 30, 2020 | 1005 | petitioner | The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes, by B. Stine et al., IEEE Trans. On Elec. Devices, Vol. 45 No. 3 March 1998, pp. 665-679 (Stine1998) Download |
Sep 30, 2020 | 1004 | petitioner | U.S. Patent No. 6,093,631 Download |
Sep 30, 2020 | 1003 | petitioner | Prosecution History for U.S. Patent No. 6,232,231 Download |
Sep 30, 2020 | 1002 | petitioner | Declaration of Dr. Duane S. Boning Download |
Sep 30, 2020 | 1001 | petitioner | U.S. Patent No. 6,232,231 Download |
Sep 1, 2021 | 10 | board | Final Written Decision: original Download |
Dec 28, 2020 | 9 | board | Download |
Dec 17, 2020 | 8 | board | Decision - Granting Institution of Inter Partes Review; Granting Motion for Joinder Download |
Dec 4, 2020 | 7 | patent_own | Patent Owner Non-Opposition to Joinder Motion Download |
Oct 21, 2020 | 6 | patent_own | Patent Owner Power of Attorney Download |
Oct 21, 2020 | 5 | patent_own | Patent Owner Mandatory Notices Download |
Oct 8, 2020 | 4 | board | Notice of Accord Filing Date Download |
Sep 30, 2020 | 3 | petitioner | Motion for Joinder to Inter Parties Review IPR2020-00603 Download |
Sep 30, 2020 | 2 | petitioner | Power of Attorney Download |
Sep 30, 2020 | 1 | petitioner | PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 6,232,231 Download |