Case number IPR2020-01732
Semiconductor Components Industries, LLC doing business as ON Semiconductor et al. v. Invensas Corporation et al. > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Dec 1, 2020 | 12 | board | Notice of Refund Download |
| Nov 16, 2020 | 11 | petitioner | Petitioner's Request for Refund of Post-Institution Fees Download |
| Nov 12, 2020 | 10 | board | Termination Decision Document Download |
| Nov 9, 2020 | 9 | petitioner | Download |
| Nov 9, 2020 | 8 | petitioner | JOINT REQUEST TO FILE SETTLEMENT AGREEMENT AS BUSINESS CONFIDENTIAL INFORMATION AND TO MAINTAIN AGREEMENT SEPARATE FROM THE PUBLIC FILE Download |
| Nov 9, 2020 | 7 | petitioner | JOINT MOTION TO TERMINATE Download |
| Oct 21, 2020 | 6 | patent_own | Patent Owner Power of Attorney Download |
| Oct 21, 2020 | 5 | patent_own | Patent Owner Mandatory Notices Download |
| Oct 9, 2020 | 4 | board | Notice of Accord Filing Date Download |
| Sep 30, 2020 | 1009 | petitioner | U.S. Pat. No. 5,841,075 Download |
| Sep 30, 2020 | 1010 | petitioner | U.S. Pat. No. 6,014,317 Download |
| Sep 30, 2020 | 1011 | petitioner | U.S. Pat. No. 5,969,426 Download |
| Sep 30, 2020 | 1012 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume I (1997) PART 2 Download |
| Sep 30, 2020 | 1012 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume I (1997) PART 1 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 4 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 6 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 2 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 1 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 3 Download |
| Sep 30, 2020 | 1013 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume II (1997) PART 5 Download |
| Sep 30, 2020 | 1014 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 3 Download |
| Sep 30, 2020 | 1014 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 4 Download |
| Sep 30, 2020 | 1014 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 1 Download |
| Sep 30, 2020 | 1 | petitioner | PETITION FOR INTER PARTES REVIEW OF U.S. Patent No. 6,317,333 Download |
| Sep 30, 2020 | 1015 | petitioner | Tsukada, et al., Surface Laminar Circuit, A Low Cost High Density Printed Circuit Board, Proceedings of the Technical Program of Surface Mount International (September 1992) Download |
| Sep 30, 2020 | 1016 | petitioner | Tsukada, Multi-Chip Packaging for Future Direction, Journal of the Japanese Institute for Interconnecting and Packaging Electronic Circuits (January 1997), including certified translation Download |
| Sep 30, 2020 | 1017 | petitioner | IEEE Electrical Insulation Magazine, Vol. 13, Issue 5, September-October 1997 Download |
| Sep 30, 2020 | 1018 | petitioner | Tsukada, et al., Surface Laminar Circuit Packaging, IEEE 42nd Electronic Components and Technology Conference (ECTC) (1992) Download |
| Sep 30, 2020 | 1019 | petitioner | Freyman et al., Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics, 1991 ECTC Proc., Atlanta, Georgia, May 1991, pp. 176-182. Download |
| Sep 30, 2020 | 1020 | petitioner | Vardaman et al., The market for ball grid array packages, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 4-5 Dec. 1995. Download |
| Sep 30, 2020 | 1021 | petitioner | Liu et al., Plastic ball grid array (PBGA) overview, Materials Chemistry and Physics 40, Elsevier, pp. 236-244, 1995 Download |
| Sep 30, 2020 | 1022 | petitioner | Mearig et al., An Overview of Manufacturing BGA Technology, 1995 IEEE/CPMT Intl Electronics Manufacturing Technology Symposium, pp. 434-437, 1995 Download |
| Sep 30, 2020 | 1023 | petitioner | Lau et al., Ball Grid Array Technology, McGraw-Hill, Inc., 1995. PART 1 Download |
| Sep 30, 2020 | 1023 | petitioner | Lau et al., Ball Grid Array Technology, McGraw-Hill, Inc., 1995. PART 2 Download |
| Sep 30, 2020 | 1024 | petitioner | Declaration of Professor Sylvia Hall-Ellis, Ph.D including: Appendix A (Curriculum Vitae) and Attachments. Download |
| Sep 30, 2020 | 2 | petitioner | Power of Attorney Download |
| Sep 30, 2020 | 3 | petitioner | Motion for Joinder to Inter Parties Review of IPR2020-00708 Download |
| Sep 30, 2020 | 1008 | petitioner | U.S. Pat. No. 5,635,767 Download |
| Sep 30, 2020 | 1007 | petitioner | Japanese Publication No. 9-8460 and machine translation from the Japan Platform for Patent Information Download |
| Sep 30, 2020 | 1006 | petitioner | Prosecution History of U.S. Application Serial No. 09/427,583 (resulting in U.S. Patent No. 6,317,333) Download |
| Sep 30, 2020 | 1005 | petitioner | Prosecution History of U.S. Application Serial No. 09/061,022 Download |
| Sep 30, 2020 | 1004 | petitioner | Japanese Publication No. 74417 (from Japanese Application No. 9-231927) and machine translation from the Japanese Platform for Patent Information Download |
| Sep 30, 2020 | 1003 | petitioner | Curriculum Vitae of Pradeep Lall, Ph.D Download |
| Sep 30, 2020 | 1002 | petitioner | Declaration of Professor Pradeep Lall, Ph.D In Support Of Petition For Inter Partes Review of U.S. Patent No. 6,317,333 (Lall) Download |
| Sep 30, 2020 | 1001 | petitioner | U.S. Patent No. 6,317,333 Download |
| Sep 30, 2020 | 1014 | petitioner | Tummala, et al., Microelectronics Packaging Handbook, Volume III (1997) PART 2 Download |
