Case number IPR2020-01670
Taiwan Semiconductor Manufacturing Company Limited v. Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung EV > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Apr 15, 2021 | 13 | petitioner | Petitioner's Updated Exhibit List Download |
| Apr 15, 2021 | 12 | board | Trial Instituted Document Download |
| Apr 15, 2021 | 1061 | petitioner | Claim Construction Order, W-20-CV-00109-ADA (WD Tx April 9, 2021) Download |
| Mar 16, 2021 | 11 | petitioner | Petitioner's Updated Exhibit List Download |
| Mar 16, 2021 | 1060 | petitioner | Order Staying Case, W-20-CV-00109-ADA (WD Tx Mar. 11, 2021) Download |
| Feb 25, 2021 | 10 | patent_own | Patent Owner's Surreply to Preliminary Response Download |
| Feb 18, 2021 | 9 | petitioner | Petitioner's Reply to Patent Owner's Preliminary Response Download |
| Feb 18, 2021 | 1059 | petitioner | Claim Construction Order, W-20-CV-00109-ADA (WD Tx Jan. 29, 2021) Download |
| Jan 20, 2021 | 8 | patent_own | Patent Owner's Preliminary Response Download |
| Jan 7, 2021 | 7 | patent_own | Patent Owner's Replacement Mandatory Notices Download |
| Oct 20, 2020 | 6 | board | Notice of Accord Filing Date Download |
| Oct 16, 2020 | 5 | patent_own | Patent Owner's Mandatory Notices Download |
| Oct 16, 2020 | 4 | patent_own | Patent Owner's Limited Power of Attorney Download |
| Sep 25, 2020 | 1013 | petitioner | U.S. Patent 5,270,261 to Claude L. Bertin et al. Download |
| Sep 25, 2020 | 1014 | petitioner | Three-Dimensional IC Trends, Proceedings of the IEEE, vol. 74, No. 12, Akasaka, Y., Dec. 1986 Download |
| Sep 25, 2020 | 1015 | petitioner | Cumulatively Bonded IC (Cubic) Technology For 3D-IC Fabrication, 8th International Workshop on Future Electron Devices, Hayashi, Y., et al., Mar. 14-16, 1990 Download |
| Sep 25, 2020 | 1016 | petitioner | Download |
| Sep 25, 2020 | 1017 | petitioner | Amalgams for Improved Electronics Interconnection, C. A. MacKay, IEEE Micro (Mar. 1993) Download |
| Sep 25, 2020 | 1018 | petitioner | Download |
| Sep 25, 2020 | 1019 | petitioner | Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond, F. Braud, et al., ME (1997) Download |
| Sep 25, 2020 | 1020 | petitioner | U.S. Patent 5,424,245 to Richard W. Gurtler et al. Download |
| Sep 25, 2020 | 1021 | petitioner | Three dimensional metallization for vertically integrated circuits, Microelectronics Engineering, P. Bollmann, P. Ramm et al. 40, 41 (1997) Download |
| Sep 25, 2020 | 1022 | petitioner | Download |
| Sep 25, 2020 | 1023 | petitioner | Fabrication Technology for Wafer Through-Hole Interconnections and Three-Dimensional Stacks of Chips and Wafers, S. Linder et al., IEEE (1994) Download |
| Sep 25, 2020 | 1024 | petitioner | U.S. Patent 5,234,850 to I-Chi Liao Download |
| Sep 25, 2020 | 1025 | petitioner | U.S. Patent 6,175,157 to Tadahiro Morifuji Download |
| Sep 25, 2020 | 1026 | petitioner | Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Proposed Scheduling Order (W.D. Tex, Aug. 21, 2020) Download |
| Sep 25, 2020 | 1027 | petitioner | Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Motion for Transfer of Venue (W.D. Tex, Aug. 21, 2020) Download |
| Sep 25, 2020 | 1030 | petitioner | Semiconductor Connections LLC v. Taiwan Semiconductor Manufacturing Company Limited et al, Case No. 6:20-cv-00109-ADA, Complaint (W.D. Tex, Feb. 11, 2020) Download |
| Sep 25, 2020 | 1031 | petitioner | U.S. Patent 4,597,827 to Akito Nishitani, et al. Download |
| Sep 25, 2020 | 1032 | petitioner | Three dimensional metallization for vertically integrated circuits, Microelectronics Engineering, P. Bollmann, P. Ramm et al. (1997) Download |
| Sep 25, 2020 | 1033 | petitioner | U.S. Patent 5,399,898 to Michael D. Rostoker Download |
| Sep 25, 2020 | 1034 | petitioner | U.S. Patent 5,627,106 to C. Hsu Download |
| Sep 25, 2020 | 1035 | petitioner | DE4433846C2 to P. Ramm, et al. Download |
| Sep 25, 2020 | 1036 | petitioner | EP-A-0926726 to U. Mastermatteo et al. Download |
| Sep 25, 2020 | 1037 | petitioner | EP-A-0531723 to C. Bertin et al. Download |
| Sep 25, 2020 | 1 | petitioner | Petitioner's Power of Attorney Download |
| Sep 25, 2020 | 1039 | petitioner | Low Stress Die Attach by Low Temperature Transient Liquid Phase Bonding, The International Society for Hybrid Microelectronics (ISHM) Symposium Proceedings, October 1992 Download |
| Sep 25, 2020 | 1040 | petitioner | Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) process. Journal of the Electrochemical Society, L. Bernstein (December 1966) Download |
| Sep 25, 2020 | 1041 | petitioner | Download |
| Sep 25, 2020 | 1042 | petitioner | The National Technology Roadmap for Semiconductors Technology Needs (1997) Download |
| Sep 25, 2020 | 1043 | petitioner | U.S. Patent 6,013,948 to S. Akram et al. Download |
| Sep 25, 2020 | 1044 | petitioner | Silicon Processing for the VLSI ERA, S. Wolf, R. Tauber, Vol., 1, 1st Ed., (1986) Download |
| Sep 25, 2020 | 1045 | petitioner | EP 1171912B1 Application File History - Certified Download |
| Sep 25, 2020 | 1046 | petitioner | EP 1171912B1 Application File History - Certificate of Translation Download |
| Sep 25, 2020 | 1047 | petitioner | JP 3895595B2 Application File History - Certified Download |
| Sep 25, 2020 | 1048 | petitioner | JP 3895595B2 Application File History - Certificate of Translation Download |
| Sep 25, 2020 | 1049 | petitioner | U.S. Patent 5,563,084 to Peter Ramm Download |
| Sep 25, 2020 | 1050 | petitioner | U.S. Patent 3,648,131 to Kenneth P. Stuby Download |
| Sep 25, 2020 | 1051 | petitioner | U.S. Patent 5,971,253 to Kenneth Gilleo et al. Download |
| Sep 25, 2020 | 1052 | petitioner | Download |
| Sep 25, 2020 | 1053 | petitioner | The Oxford Dictionary and Thesaurus, Oxford University Press(1996) Download |
| Sep 25, 2020 | 1054 | petitioner | The Oxford Modern English Dictionary, Oxford University Press(1993) Download |
| Sep 25, 2020 | 1055 | petitioner | U.S. Patent 6,221,769 to S. Dhong et al Download |
| Sep 25, 2020 | 1056 | petitioner | Improved TiN Film as a Diffusion Barrier Between Copper and Silicon, Thin Solid Films 320, 134 (1998) Download |
| Sep 25, 2020 | 1057 | petitioner | Barrier Properties of Very Thin Ta and TaN Layers Against Copper Diffusion, J. Electrochem Soc. Vol. 145, No. 7, 2538 (July 1998) Download |
| Sep 25, 2020 | 1058 | petitioner | U.S. Patent 5,608,264 to S. Gaul Download |
| Sep 25, 2020 | 2 | petitioner | Petition for Inter Partes Review of U.S. Patent 6,548,391 Download |
| Sep 25, 2020 | 3 | petitioner | Download |
| Sep 25, 2020 | 1012 | petitioner | U.S. Patent 6,002,177 to Michael Anthony Gaynes, et al. Download |
| Sep 25, 2020 | 1011 | petitioner | U.S. Patent 5,426,072 to Ronald M. Finnila Download |
| Sep 25, 2020 | 1010 | petitioner | EP0559366 to Paul T. Lin Download |
| Sep 25, 2020 | 1009 | petitioner | U.S. Patent 4,939,568 to Takashi Kato et al. Download |
| Sep 25, 2020 | 1008 | petitioner | U.S. Patent 5,258,648 to Paul T. Lin Download |
| Sep 25, 2020 | 1007 | petitioner | U.S. Patent 5,529,950 to Wolfgang Hoenlein, et al. Download |
| Sep 25, 2020 | 1006 | petitioner | JP 3895595B2 Application File History - Certified English Translation Download |
| Sep 25, 2020 | 1005 | petitioner | EP 1171912B1 Application File History- Certified English Translation Download |
| Sep 25, 2020 | 1004 | petitioner | Curriculum Vitae of Dr. Wilmer Bottoms, Ph.D Download |
| Sep 25, 2020 | 1003 | petitioner | Declaration of Dr. Wilmer Bottoms, Ph.D in Support of IPR Petition Download |
| Sep 25, 2020 | 1002 | petitioner | File History of U.S. Patent 5,548,391 Download |
| Sep 25, 2020 | 1001 | petitioner | U.S. Patent 6,548,391 to Peter Ramm et al. Download |
| Sep 25, 2020 | 1038 | petitioner | U.S. Patent 3,613,226 to Robert W. Haisty et al. Download |
