Case number IPR2017-00841
Xilinx, Inc. v. Godo Kaisha IP Bridge 1 > Documents
| Date Field | Doc. No. | Party | Description |
|---|---|---|---|
| Sep 11, 2017 | 10 | Notice of Refund Download | |
| Sep 7, 2017 | 9 | XIL-7525189IPR Request for Refund of Post-Institution Fees Download | |
| Aug 28, 2017 | 8 | Decision - Denying Institution of Inter Partes Review Download | |
| May 30, 2017 | 2005 | Flip Chip Technologies (excerpt) Download | |
| May 30, 2017 | 7 | Patent Owner Preliminary Response Download | |
| May 30, 2017 | 2003 | Thermal Expansion of Composite Materials (1970) Download | |
| May 30, 2017 | 2001 | New IEEE Standard Dictionary of Electrical and Electronics Terms Download | |
| May 30, 2017 | 2004 | Linear Thermal Expansion Coefficient for Metals, Advanced Mechanical Engineering Solutions Download | |
| May 30, 2017 | 2002 | Surface Mount Technology Terms and Concepts (1997) Download | |
| Feb 28, 2017 | 6 | Notice of Accord Filing Date Download | |
| Feb 22, 2017 | 4 | Patent Owner's Mandatory Notices Download | |
| Feb 22, 2017 | 5 | Power of Attorney Download | |
| Feb 1, 2017 | 3 | CertificateofService Download | |
| Feb 1, 2017 | 1006 | Exhibit_1006-US6617681 Download | |
| Feb 1, 2017 | 1007 | Exhibit_1007-Dorf-Electrical_Engineering_Handbook Download | |
| Feb 1, 2017 | 1 | Petition Download | |
| Feb 1, 2017 | 1001 | Exhibit_1001-US7525189 Download | |
| Feb 1, 2017 | 2 | POA Download | |
| Feb 1, 2017 | 1005 | Exhibit_1005-US5258648 Download | |
| Feb 1, 2017 | 1004 | Exhibit_1004-US20020180015A1 Download | |
| Feb 1, 2017 | 1003 | Exhibit_1003-Qu_Curriculum_Vitae Download | |
| Feb 1, 2017 | 1002 | Exhibit_1002_Qu-Expert_Declaration-7525189 Download |
