Date Field | Doc. No. | Party | Description |
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Sep 11, 2017 | 10 | | Notice of Refund Download |
Sep 7, 2017 | 9 | | XIL-7525189IPR Request for Refund of Post-Institution Fees Download |
Aug 28, 2017 | 8 | | Decision - Denying Institution of Inter Partes Review Download |
May 30, 2017 | 2005 | | Flip Chip Technologies (excerpt) Download |
May 30, 2017 | 7 | | Patent Owner Preliminary Response Download |
May 30, 2017 | 2003 | | Thermal Expansion of Composite Materials (1970) Download |
May 30, 2017 | 2001 | | New IEEE Standard Dictionary of Electrical and Electronics Terms Download |
May 30, 2017 | 2004 | | Linear Thermal Expansion Coefficient for Metals, Advanced Mechanical Engineering Solutions Download |
May 30, 2017 | 2002 | | Surface Mount Technology Terms and Concepts (1997) Download |
Feb 28, 2017 | 6 | | Notice of Accord Filing Date Download |
Feb 22, 2017 | 4 | | Patent Owner's Mandatory Notices Download |
Feb 22, 2017 | 5 | | Power of Attorney Download |
Feb 1, 2017 | 3 | | CertificateofService Download |
Feb 1, 2017 | 1006 | | Exhibit_1006-US6617681 Download |
Feb 1, 2017 | 1007 | | Exhibit_1007-Dorf-Electrical_Engineering_Handbook Download |
Feb 1, 2017 | 1 | | Petition Download |
Feb 1, 2017 | 1001 | | Exhibit_1001-US7525189 Download |
Feb 1, 2017 | 2 | | POA Download |
Feb 1, 2017 | 1005 | | Exhibit_1005-US5258648 Download |
Feb 1, 2017 | 1004 | | Exhibit_1004-US20020180015A1 Download |
Feb 1, 2017 | 1003 | | Exhibit_1003-Qu_Curriculum_Vitae Download |
Feb 1, 2017 | 1002 | | Exhibit_1002_Qu-Expert_Declaration-7525189 Download |