Patents
| Application | Patent/Pub No | Title | Issuance Date |
|---|---|---|---|
| 17754731 | 12166564 | Adjusting polarization states for wireless transmission | Dec 10, 2024 |
| 17536668 | 12166826 | User plane connection establishment method and apparatus, and system | Dec 10, 2024 |
| 17269407 | 12167258 | Communication apparatus, method, program and recording medium | Dec 10, 2024 |
| 17685956 | 12167284 | Multi-operator radio access network | Dec 10, 2024 |
| 17694383 | 12167450 | Apparatus and method of wireless communication | Dec 10, 2024 |
| 18200198 | 12161290 | Systems and methods for high-speed data transmission across an... | Dec 10, 2024 |
| 17269449 | 12162944 | Human IL-4R binding antibody, antigen binding fragment thereof, and... | Dec 10, 2024 |
| 18165251 | 12163543 | Rivet with improved structure for forming flat-bottom riveting of... | Dec 10, 2024 |
| 17937065 | 12163704 | Multi-feed chiller-heater production module and method of controlling ... | Dec 10, 2024 |
| 17756283 | 12163884 | Infrared imaging system and related method | Dec 10, 2024 |
| 17797679 | 12164136 | Display device and optical element for use in the display device | Dec 10, 2024 |
| 17203705 | 12165046 | Enabling hierarchical data loading in a resistive processing unit... | Dec 10, 2024 |
| 18233827 | 12165253 | Asynchronous and concurrent ray tracing and rasterization rendering... | Dec 10, 2024 |
| 18606668 | 12165426 | Visual structure of documents in question answering | Dec 10, 2024 |
| 18352127 | 12165704 | Memory device with write pulse trimming | Dec 10, 2024 |
| 17957187 | 12166148 | Repair method for sealing the back of photovoltaic modules | Dec 10, 2024 |
| 17775933 | 12166664 | First node, second node, fourth node and methods performed thereby in ... | Dec 10, 2024 |
| 18169340 | 12166822 | Performance impact information for adjusting rate of a data... | Dec 10, 2024 |
| 17682976 | 12167595 | Semiconductor device and method of manufacturing the same | Dec 10, 2024 |
| 17770019 | 12165877 | Methods for etching a material layer for semiconductor applications | Dec 10, 2024 |