Method and apparatus for removing contaminants from solder | Patent Number 05388756

US 05388756 NA
Application Number8173012
Publication Number-
Pendency1 year, 1 month, 19 days
Filled DateDec 27, 1993
Priority DateDec 27, 1993
Publication Date-
Expiration DateDec 27, 2013
Inventor/Applicants Ronald E. Howlett
ExaminesKNAPP, JEFFREY T
Art Unit3205
Technology Center3200
Assignments
At&t Company
Current
At&t ServicesAt&t Company
Original
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