Method for forming solder bumps on a substrate using an electrodeposition technique | Patent Number 05396702

US 05396702 NA
Application Number8167687
Publication Number-
Pendency1 year, 2 months, 29 days
Filled DateDec 15, 1993
Priority DateDec 15, 1993
Publication Date-
Expiration DateDec 15, 2013
Inventor/Applicants Mindaugas F. Dautartas
ExaminesBRYANT, DAVID P
Art Unit3206
Technology Center3200
Assignments
At&t Company
Current
At&t ServicesAt&t Company
Original
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