Manufacture of semiconductor devices and novel lead frame assembly | Patent Number 05408126

US 05408126 NA
Application Number8168706
Publication Number-
Pendency1 year, 4 months, 2 days
Filled DateDec 17, 1993
Priority DateDec 17, 1993
Publication Date-
Expiration DateDec 17, 2013
Inventor/Applicants Yang C. Chen
ExaminesCLARK, SHEILA V
Art Unit2503
Technology Center2500
Assignments
At&t Company
Current
At&t ServicesAt&t Company
Original
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