Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films | Patent Number 05473433

US 05473433 NA
Application Number8285458
Publication Number-
Pendency1 year, 4 months, 4 days
Filled DateAug 3, 1994
Priority DateDec 7, 1993
Publication Date-
Expiration DateDec 5, 1999
Inventor/Applicants Anton J. Miller
ExaminesKIM, ROBERT H
Art Unit2505
Technology Center2500
Assignments
At&t Company
Current
At&t ServicesAt&t Company
Original
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