Method and device for bonding a wire conductor | Patent Number 06233818

US 06233818 NA
Application Number9117970
Publication Number-
Pendency2 years, 9 months, 19 days
Filled DateAug 7, 1998
Priority DateFeb 12, 1997
Publication Date-
Expiration DateFeb 12, 2017
Inventor/Applicants David Finn
Manfred Rietzler
ExaminesARBES, CARL J
Art Unit3729
Technology Center3700
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