Bonding method of electronic parts employing ultrasonic coupling oscillation | Patent Number 06299051

US 06299051 NA
Application Number9533078
Publication Number-
Pendency1 year, 6 months, 21 days
Filled DateMar 22, 2000
Priority DateMar 22, 2000
Publication Date-
Expiration DateMar 22, 2020
Inventor/Applicants Jiromaru Tsujino
ExaminesJOHNSON, JONATHAN J
Art Unit1725
Technology Center1700
Assignments
Asahi Rubber Inc.
Current
Asahi Rubber Inc.
Original
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