Multi-layered wiring layer and method of fabricating the same | Patent Number 06538324

US 06538324 B1
Application Number9596415
Publication Number-
Pendency2 years, 9 months, 9 days
Filled DateJun 19, 2000
Priority DateJun 19, 2000
Publication Date-
Expiration DateJun 19, 2020
Inventor/ApplicantsMasayoshi Tagami
Yoshihiro Hayashi
ExaminesVU, HUNG K
Art Unit2811
Technology Center2800
Assignments
Godo Kaisha Ip Bridge 1
Current
Nec CorporationAt&t Company
Original
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