Metal stack for local interconnect layer | Patent Number 06774033

US 06774033 B1
Application Number10287258
Publication Number-
Pendency1 year, 9 months, 10 days
Filled DateNov 4, 2002
Priority DateNov 4, 2002
Publication Date-
Expiration DateNov 4, 2022
Inventor/ApplicantsMira Ben-Tzur
Gorley L. Lau
Krishnaswamy Ramkumar
Dafna Beery
ExaminesSMITH, BRADLEY
Art Unit2824
Technology Center2800
Assignments
Infineon Technologies Ag
Current
Cypress SemiconductorInfineon Technologies Ag
Original
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