Dummy fill for integrated circuits | Patent Number 07124386

US 07124386 B2
Application Number10164844
Publication NumberUS 20030226757 A1
Pendency4 years, 4 months, 13 days
Filled DateJun 7, 2002
Priority DateJun 7, 2002
Publication DateDec 11, 2003
Expiration DateJun 7, 2022
Inventor/ApplicantsTaber H. Smith
Vikas Mehrotra
David White
Vikas Mehrotra
Taber H. Smith
David White
ExaminesLIN, SUN J
Art Unit2825
Technology Center2800
Assignments
Cadence Design Systems Inc.
Current
Praesagus Inc.
Original
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