Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation | Patent Number 07646091

US 07646091 B2
Application Number11399723
Publication NumberUS 20070235849 A1
Pendency3 years, 9 months, 12 days
Filled DateApr 6, 2006
Priority DateApr 6, 2006
Publication DateOct 11, 2007
Expiration DateApr 5, 2026
Inventor/ApplicantsChok J. Chia
Maurice O. Othieno
Amar J. Amin
ExaminesCRUZ, LESLIE PILAR
Art Unit2826
Technology Center2800
Assignments
Hilco Patent Acquisition 55 Llc
Current
Bellnorthern Research
Current
Bell Semiconductor Llc
Current
Lsi BroadcomBroadcom
Original
Lsi Logic Corporation
Original
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