Interconnect structure and method for semiconductor device | Patent Number 07768134

US 07768134 B2
Application Number12368598
Publication NumberUS 20090146290 A1
Pendency1 year, 5 months, 24 days
Filled DateFeb 10, 2009
Priority DateFeb 17, 2006
Publication DateJun 11, 2009
Expiration DateFeb 16, 2026
Inventor/ApplicantsTadashi Iijima
Yoshiaki Shimooka
ExaminesHOANG, QUOC DINH
Art Unit2892
Technology Center2800
Assignments
Toshiba America Electronic Components
Current
Toshiba America Electronic ComponentsToshiba
Original
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