Method of assembly and assembly thus made | Patent Number 08268672

US 08268672 B2
Application Number11579677
Publication NumberUS 20110275176 A1
Pendency7 years, 4 months, 25 days
Filled DateApr 28, 2005
Priority DateApr 28, 2005
Publication DateNov 10, 2011
Expiration DateApr 27, 2025
Inventor/ApplicantsHendrik Pieter Hochstenbach
Nicolaas Johannes Anthonius Van Veen
ExaminesTRINH, HOA B
Art Unit2893
Technology Center2800
Assignments
Morgan Stanley Senior Funding Inc.
Current
Nxp BvNxp Semiconductors
Original
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