Substrate structure for an image sensor package and method for manufacturing the same | Patent Number 08314481
US 08314481 B2Filled DateMay 18, 2005
Priority DateMay 18, 2005
Publication DateDec 7, 2006
Expiration DateMay 17, 2025
Inventor/ApplicantsYves Huang
Kevin Chang
Chief Lin
Chung Hsien Hsin
Kevin Chang
Chief Lin
Chung Hsien Hsin
ExaminesTRAN, THANH Y
Art Unit2829
Technology Center2800
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