Board/tile spacer and associated package assembly | Patent Number 10538924

US 10538924 B2
Application Number14449863
Publication NumberUS 20160032598 A1
Pendency5 years, 5 months, 24 days
Filled DateAug 1, 2014
Priority DateAug 1, 2014
Publication DateFeb 4, 2016
Expiration DateJul 31, 2034
Inventor/ApplicantsRonald Scott Anderson
ExaminesCHU, KING M
Art Unit3735
Technology Center3700
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