Methods of treatment using topical copper ion formulations | Patent Number 11253544

US 11253544 B2
Application Number17227037
Publication NumberUS 20210220399 A1
Pendency10 months, 19 days
Filled DateApr 9, 2021
Priority DateMar 15, 2013
Publication DateJul 22, 2021
Expiration DateMar 14, 2033
Inventor/ApplicantsChunLim ABBOTT
Dominic C. ABBOTT
Dominic C. Abbott
ChunLim Abbott
ExaminesLIU, TRACY
Art Unit1612
Technology Center1600
Assignments
Cda Research Group Inc.
Current
Cda Research Group Inc.
Original
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