Molded die slivers with exposed front and back surfaces | Patent Number 11292257

US 11292257 B2
Application Number16704122
Publication NumberUS 20200180314 A1
Pendency2 years, 4 months, 2 days
Filled DateDec 5, 2019
Priority DateMar 18, 2014
Publication DateJun 11, 2020
Expiration DateMar 17, 2034
Inventor/ApplicantsChien-Hua Chen
Michael W Cumbie
ExaminesUHLENHAKE, JASON S
Art Unit2853
Technology Center2800
Assignments
Hewlett Packard Enterprise
Current
Hewlett Packard Enterprise
Original
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