Antibodies binding CD70, preparation and use thereof | Patent Number 11613584

US 11613584 B1
Application Number17685501
Publication NumberUS 20230112123 A1
Pendency1 year, 25 days
Filled DateMar 3, 2022
Priority DateMar 3, 2022
Publication DateApr 13, 2023
Expiration DateMar 2, 2042
Inventor/ApplicantsHuiqin GUO
Wenzhi TIAN
Dianze CHEN
Wenzhi Tian
Huiqin Guo
Dianze Chen
Song Li
Song LI
ExaminesBENAVIDES, JENNIFER ANN
Art Unit1649
Technology Center1600
Assignments
Immuneonco Biopharmaceuticals Shanghai Co. Ltd.
Current
Immuneonco Biopharmaceuticals Shanghai Co. Ltd.
Original
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