Bonding label | Patent Number 11702268

US 11702268 B2
Application Number17373252
Publication NumberUS 20210339933 A1
Pendency2 years, 6 days
Filled DateJul 12, 2021
Priority DateJan 22, 2019
Publication DateNov 4, 2021
Expiration DateJan 21, 2039
Inventor/ApplicantsMark A. Shadle
ExaminesNORDMEYER, PATRICIA L
Art Unit1788
Technology Center1700
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