System and apparatus for sequential transient liquid phase bonding | Patent Number 11715929

US 11715929 B2
Application Number17734506
Publication NumberUS 20230123042 A1
Pendency1 year, 3 months, 1 day
Filled DateMay 2, 2022
Priority DateOct 15, 2021
Publication DateApr 20, 2023
Expiration DateOct 14, 2041
Inventor/ApplicantsZhizhong Tang
Wenjing Liang
Pradeep Srinivasan
Kevin Masuda
ExaminesNGUYEN, TUAN N
Art Unit2828
Technology Center2800
Assignments
Aeva Inc.
Current
Aeva Inc.
Original
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