Thermocouple device | Patent Number 11765975

US 11765975 B2
Application Number17571299
Publication NumberUS 20220209093 A1
Pendency1 year, 8 months, 15 days
Filled DateJan 7, 2022
Priority DateJun 29, 2017
Publication DateJun 30, 2022
Expiration DateJun 28, 2037
Inventor/ApplicantsJheng-Yuan WANG
Ming-Hsien Tsai
Shang-Ying Tsai
Fu-Lung HSUEH
Ming-De CHEN
Jheng-Yuan Wang
Ming-De Chen
Shang-Ying TSAI
Shih-Ming YANG
Fu-Lung Hsueh
Shih-Ming Yang
Ming-Hsien TSAI
ExaminesCHERN, CHRISTINA
Art Unit1721
Technology Center1700
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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