Substrate processing apparatus and substrate processing method | Patent Number 11801537

US 11801537 B2
Application Number17661601
Publication NumberUS 20220362813 A1
Pendency1 year, 6 months, 2 days
Filled DateMay 2, 2022
Priority DateMay 2, 2022
Publication DateNov 17, 2022
Expiration DateMay 1, 2042
Inventor/ApplicantsTakahito Nakashoya
Takahito NAKASHOYA
ExaminesBERGNER, ERIN FLANAGAN
Art Unit1713
Technology Center1700
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