Semiconductor chip including through electrode, and semiconductor package including the same | Patent Number 11823982

US 11823982 B2
Application Number18103346
Publication NumberUS 20230178456 A1
Pendency9 months, 25 days
Filled DateJan 30, 2023
Priority DateMar 3, 2021
Publication DateJun 8, 2023
Expiration DateMar 2, 2041
Inventor/ApplicantsMi Seon Lee
Sung Kyu Kim
Ho Young Son
Sung Kyu KIM
Ho Young SON
Mi Seon LEE
ExaminesDIALLO, MAMADOU L
Art Unit2897
Technology Center2800
Assignments
Sk Hynix
Current
Sk HynixSk Group
Original
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