Imaging module, endoscope system, and imaging module manufacturing method | Patent Number 11832796

US 11832796 B2
Application Number17957305
Publication NumberUS 20230029662 A1
Pendency1 year, 2 months, 6 days
Filled DateSep 30, 2022
Priority DateMay 8, 2020
Publication DateFeb 2, 2023
Expiration DateMay 7, 2040
Inventor/ApplicantsTakuro Suyama
ExaminesPYO, KEVIN K
Art Unit2878
Technology Center2800
Assignments
Olympus Corporation
Current
Olympus Corporation
Original
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