Method of forming tungsten film and system therefor | Patent Number 11840759

US 11840759 B2
Application Number17653690
Publication NumberUS 20220290294 A1
Pendency1 year, 9 months, 10 days
Filled DateMar 7, 2022
Priority DateMar 7, 2022
Publication DateSep 15, 2022
Expiration DateMar 6, 2042
Inventor/ApplicantsMasafumi TAKAHASHI
Masaki SANO
Kenji SUZUKI
Masafumi Takahashi
Tsuyoshi Takahashi
Kenji Suzuki
Masaki Sano
Tsuyoshi TAKAHASHI
ExaminesTSCHEN, FRANCISCO W
Art Unit1712
Technology Center1700
Assignments
Tokyo Electron Limited
Current
Tokyo Electron Limited
Original
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