Integrated semiconductor die parceling platforms | Patent Number 11851224

US 11851224 B2
Application Number17686299
Publication NumberUS 20220185512 A1
Pendency1 year, 9 months, 28 days
Filled DateMar 3, 2022
Priority DateOct 26, 2018
Publication DateJun 16, 2022
Expiration DateOct 25, 2038
Inventor/ApplicantsChieh-Chun Lin
Shine Chen
Tsung-Sheng KUO
Chieh-Chun LIN
Tsung-Sheng Kuo
Hsu-Shui Liu
Hsu-Shui LIU
Shine CHEN
Jiun-Rong PAI
Jiun-Rong Pai
Yang-Ann Chu
Yang-Ann CHU
ExaminesSONG, HIMCHAN
Art Unit3731
Technology Center3700
Assignments
Taiwan Semiconductor Manufacturing Company
Current
Taiwan Semiconductor Manufacturing Company
Original
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