Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate | Patent Number 11886119
US 11886119 B2Filled DateFeb 13, 2023
Priority DateMay 30, 2018
Publication DateJun 15, 2023
Expiration DateMay 29, 2038
Inventor/ApplicantsKoji Inoue
Keisuke KAWASHIMA
Koji INOUE
Takashi Oda
Keisuke Kawashima
Takashi ODA
Keisuke KAWASHIMA
Koji INOUE
Takashi Oda
Keisuke Kawashima
Takashi ODA
ExaminesFANG, SHANE
Art Unit1766
Technology Center1700
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