Material for forming underlayer film, resist underlayer film, method of producing resist underlayer film, and laminate | Patent Number 11886119

US 11886119 B2
Application Number18168261
Publication NumberUS 20230185195 A1
Pendency11 months, 21 days
Filled DateFeb 13, 2023
Priority DateMay 30, 2018
Publication DateJun 15, 2023
Expiration DateMay 29, 2038
Inventor/ApplicantsKoji Inoue
Keisuke KAWASHIMA
Koji INOUE
Takashi Oda
Keisuke Kawashima
Takashi ODA
ExaminesFANG, SHANE
Art Unit1766
Technology Center1700
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