Apparatus and methods for burst communications within die architectures | Patent Number 11886369

US 11886369 B1
Application Number18466923
Publication Number-
Pendency4 months, 18 days
Filled DateSep 14, 2023
Priority DateSep 14, 2023
Publication Date-
Expiration DateSep 13, 2043
Inventor/ApplicantsParth Saurabhkumar Shah
Philip Hardy
Imran Ghazi
ExaminesDALEY, CHRISTOPHER ANTHONY
Art Unit2184
Technology Center2100
Assignments
Qualcomm Technologies Inc.
Current
Qualcomm Technologies Inc.
Original
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