Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device | Patent Number 11916038

US 11916038 B2
Application Number17962061
Publication NumberUS 20230051810 A1
Pendency1 year, 4 months, 23 days
Filled DateOct 7, 2022
Priority DateFeb 7, 2022
Publication DateFeb 16, 2023
Expiration DateFeb 6, 2042
Inventor/ApplicantsTakayuki SAITOH
Takayuki MORIWAKI
Takehito SHIMATSU
Takayuki Saitoh
Takehito Shimatsu
Miyuki Uomoto
Miyuki UOMOTO
Takayuki Moriwaki
ExaminesDIALLO, MAMADOU L
Art Unit2897
Technology Center2800
Assignments
Tohoku University
Current
Canon Anelva Corporation
Current
Canon Anelva CorporationTohoku University
Original
Canon Inc.
Original
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