Apparatus for processing substrate and method of transferring substrate | Patent Number 11961758

US 11961758 B2
Application Number17653889
Publication NumberUS 20220301921 A1
Pendency2 years, 1 month, 10 days
Filled DateMar 8, 2022
Priority DateMar 8, 2022
Publication DateSep 22, 2022
Expiration DateMar 7, 2042
Inventor/ApplicantsTakehiro Shindo
Takehiro SHINDO
ExaminesLOWE, MICHAEL S
Art Unit3652
Technology Center3600
Assignments
Tokyo Electron Limited
Current
Tokyo Electron Limited
Original
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