METHOD FOR FIXING THE SUBSTRATE OF AN ACOUSTIC TRANSDUCER | Patent Publication Number 20020076041
US 20020076041 A1Publication DateJun 20, 2002
Original Assignee
Current AssigneeNokia Mobile Phones Lt'd.
Inventor/ApplicantsJARMO HIETANEN
International
1
H04M
National
1
379/433.30
Field of Search
0
- 1. A method in connection with an acoustic transducer, such as a microphone (1), for a communication device, such as a wireless communication device (4), in which method the acoustic transducer (1) is attached to a substrate (2), such as a circuit board, or integrated in the substrate (2), and the housing (5) of the communication device is formed of at least a first (5a) and a second part (5b), characterized in that the substrate (2) is provided with one or more apertures (3a-3f), partly surrounding the acoustic transducer (1) in order to achieve an almost floating attachment for the acoustic transducer (1).
- 4. A communication device (4), such as a wireless communication device, in which an acoustic transducer (1), such as a microphone (1), is attached to a substrate (2), such as a circuit board, or integrated in the substrate (2), and the housing (5) of the communication device is formed of at least a first (5a) and a second part (5b), characterized in that the substrate (2) is provided with one or more apertures (3a-3f) partly surrounding the acoustic transducer (1) in order to achieve an almost floating attachment for the acoustic transducer (1).
- 10. The communication device (4) according to any of the claims 4 to 9, characterized in that the acoustic transducer (1) is a non-encapsulated microphone.
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