Semiconductor device, laminated semiconductor device, and method for producing semiconductor device | Patent Publication Number 20060267190
US 20060267190 A1Publication DateNov 30, 2006
Original AssigneeSharp Corporation
Current AssigneeSharp Corporation
Inventor/ApplicantsToshihisa Gotoh
Tomonori Terada
Tomonori Terada
International
1
H01L
National
1
257/723.
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