Semiconductor device, laminated semiconductor device, and method for producing semiconductor device | Patent Publication Number 20060267190

US 20060267190 A1
Patent Number-
Application Number11438281
Filled DateMay 23, 2006
Priority DateMay 23, 2006
Publication DateNov 30, 2006
Original AssigneeSharp Corporation
Current AssigneeSharp Corporation
Inventor/ApplicantsToshihisa Gotoh
Tomonori Terada
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