Packaging structure of a semiconductor device | Patent Publication Number 20150021753

US 20150021753 A1
Patent NumberUS 09281265 B2
Application Number14488586
Filled DateSep 17, 2014
Priority DateMar 15, 2013
Publication DateJan 22, 2015
Inventor/ApplicantsLiang Zhao
Jun Lu
Ping Huang
Yan Xun Xue
Lei Shi
Yueh-Se Ho
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