Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | Patent Publication Number 20180208703
US 20180208703 A1Patent NumberUS 10364314 B2
Application Number15746107
Filled DateJul 15, 2016
Priority DateJul 15, 2016
Publication DateJul 26, 2018
Original AssigneeMitsubishi Electric Corporation
Current AssigneeMitsubishi Gaschemical Company Inc.
Inventor/ApplicantsTakashi MAKINOSHIMA
Kana OKADA
Masatoshi ECHIGO
Junya HORIUCHI
Takashi Makinoshima
Kana Okada
Masatoshi Echigo
Junya Horiuchi
Kana OKADA
Masatoshi ECHIGO
Junya HORIUCHI
Takashi Makinoshima
Kana Okada
Masatoshi Echigo
Junya Horiuchi
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