Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification method | Patent Publication Number 20180208703

US 20180208703 A1
Patent NumberUS 10364314 B2
Application Number15746107
Filled DateJul 15, 2016
Priority DateJul 15, 2016
Publication DateJul 26, 2018
Inventor/ApplicantsTakashi MAKINOSHIMA
Kana OKADA
Masatoshi ECHIGO
Junya HORIUCHI
Takashi Makinoshima
Kana Okada
Masatoshi Echigo
Junya Horiuchi
See the invalidated claims, subscribe to our Concierge Program.
View Concierge Program
Patent Prosecution report image

Empower your practice with Patexia Publication Prosecution IP Module.

Get access to our exclusive rankings and unlock powerful data.

Looking for a Publication Attorney?

Get in touch with our team or create your account to start exploring a network of over 120K attorneys.