RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | Patent Publication Number 20220112414

US 20220112414 A1
Patent Number-
Application Number17496382
Filled DateOct 7, 2021
Priority DateOct 7, 2021
Publication DateApr 14, 2022
Original AssigneeAjinomoto Co. Inc.
Current AssigneeAjinomoto Co. Inc.
Inventor/ApplicantsKenji KAWAI
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