DUAL CRITICAL DIMENSION PATTERNING | Patent Publication Number 20220328304
US 20220328304 A1Publication DateOct 13, 2022
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsKuo-Chang Kau
Chia-Chu Liu
Hua-Tai Lin
Wen-Yun Wang
Chia-Chu Liu
Hua-Tai Lin
Wen-Yun Wang
See the invalidated claims, subscribe to our Concierge Program.
View Concierge ProgramEmpower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.