Isolation Structures | Patent Publication Number 20230048829
US 20230048829 A1Publication DateFeb 16, 2023
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsKai-Hsuan Lee
Shih-Che Lin
Mei-Yun Wang
Shih-Chieh Wu
Po-Yu Huang
Chen-Ming Lee
Fu-Kai Yang
I-Wen Wu
Shih-Che Lin
Mei-Yun Wang
Shih-Chieh Wu
Po-Yu Huang
Chen-Ming Lee
Fu-Kai Yang
I-Wen Wu
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