SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD OF FABRICATING THEREOF | Patent Publication Number 20230067799

US 20230067799 A1
Patent Number-
Application Number17446419
Filled DateAug 30, 2021
Priority DateAug 30, 2021
Publication DateMar 2, 2023
Original Assignee
Current AssigneeTaiwan Semiconductor Manufacturing Company
Inventor/ApplicantsLin-Yu HUANG
Chia-Hao CHANG
Cheng-Chi CHUANG
Sheng-Tsung WANG
Chih-Hao WANG
Kuan-Lun CHENG
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