Semiconductor structure and method of wafer bonding | Patent Publication Number 20230268246

US 20230268246 A1
Patent NumberUS 12080622 B2
Application Number18136329
Filled DateApr 18, 2023
Priority DateJul 9, 2020
Publication DateAug 24, 2023
Inventor/ApplicantsChee Hau Ng
Purakh Raj Verma
Chia-Liang Liao
Ching-Yang Wen
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