Semiconductor structure and method of wafer bonding | Patent Publication Number 20230268246
US 20230268246 A1Patent NumberUS 12080622 B2
Application Number18136329
Filled DateApr 18, 2023
Priority DateJul 9, 2020
Publication DateAug 24, 2023
Original AssigneeUnited Microelectronics Corporation
Current AssigneeUnited Microelectronics Corporation
Inventor/ApplicantsChee Hau Ng
Purakh Raj Verma
Chia-Liang Liao
Ching-Yang Wen
Purakh Raj Verma
Chia-Liang Liao
Ching-Yang Wen
See the invalidated claims, subscribe to our Concierge Program.
View Concierge ProgramEmpower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.