Copper Wire Bonding Apparatus Using A Purge Gas to Enhance Ball Bond Reliability | Patent Publication Number 20150243534
US 20150243534 A1Publication DateAug 27, 2015
Original AssigneeBroadcom
Current AssigneeLsi Broadcom
Agere Systems Broadcom
Agere Systems Broadcom
Inventor/Applicants
Empower your practice with Patexia Publication Prosecution IP Module.
Get access to our exclusive rankings and unlock powerful data.
Looking for a Publication Attorney?
Get in touch with our team or create your account to start exploring a
network of over 120K attorneys.