FLUIDIC DIE | Patent Publication Number 20230191779

US 20230191779 A1
Patent Number-
Application Number18113610
Filled DateFeb 23, 2023
Priority DateApr 14, 2017
Publication DateJun 22, 2023
Original AssigneeHewlett Packard Enterprise
Current AssigneeHewlett Packard Enterprise
Inventor/ApplicantsDonald J. Milligan
Eric T. Martin
Sean P. McClelland
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