SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME | Patent Publication Number 20230197687

US 20230197687 A1
Patent Number-
Application Number18108503
Filled DateFeb 10, 2023
Priority DateAug 10, 2021
Publication DateJun 22, 2023
Original AssigneeSk Group
Current AssigneeSk Hynix
Inventor/ApplicantsJu Il EOM
Byung Jun BANG
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